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www.EESemi.com - All About Semiconductor Manufacturing
SEMICONDUCTOR MANUFACTURING Take some sand, purify it, make it flat, add materials to it, cut it into little chips, attach the chips to metal ...
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Semiconductor Reliability
"Semiconductor Reliability Engineering" refers to the development of technology, processes, and standards to ensure the reliability of semiconductor devices during appli...
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Semiconductor Manufacturing Equipment
The process of manufacturing integrated circuits is so complex that it could involve more than 50 different pieces of semiconductor equipment from the time silica...
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System in a Package (SIP) : The 3-D Package
SIP refers to a semiconductor device that incorporates multiple chips that make up a complete electronic system into a single package. Electronic devices like mobile pho...
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IC Package Types or Outlines
TSOP - Thin Small Outline Package TSSOP - Thin Shrink Small Outline Package UTDFN - Ultra Thin Dual Flat No Leads Package UTQFN - Ultra Thin Quad Flat No Leads Package VFBGA - Very Thin Fine-Pitch Bal...
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Encoders and Decoders; Multiplexers and Demultiplexers
common circuits to feed a common load with signals from several signal sources, and to feed several loads from a single, common signal source, respectively. encoding ...